JPH055355B2 - - Google Patents

Info

Publication number
JPH055355B2
JPH055355B2 JP60218754A JP21875485A JPH055355B2 JP H055355 B2 JPH055355 B2 JP H055355B2 JP 60218754 A JP60218754 A JP 60218754A JP 21875485 A JP21875485 A JP 21875485A JP H055355 B2 JPH055355 B2 JP H055355B2
Authority
JP
Japan
Prior art keywords
light emitting
light
display
conductive
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60218754A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6275697A (ja
Inventor
Masanobu Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takiron Co Ltd
Original Assignee
Takiron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takiron Co Ltd filed Critical Takiron Co Ltd
Priority to JP60218754A priority Critical patent/JPS6275697A/ja
Publication of JPS6275697A publication Critical patent/JPS6275697A/ja
Publication of JPH055355B2 publication Critical patent/JPH055355B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP60218754A 1985-09-30 1985-09-30 発光ダイオ−ドチツプを用いた発光表示体 Granted JPS6275697A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60218754A JPS6275697A (ja) 1985-09-30 1985-09-30 発光ダイオ−ドチツプを用いた発光表示体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60218754A JPS6275697A (ja) 1985-09-30 1985-09-30 発光ダイオ−ドチツプを用いた発光表示体

Publications (2)

Publication Number Publication Date
JPS6275697A JPS6275697A (ja) 1987-04-07
JPH055355B2 true JPH055355B2 (en]) 1993-01-22

Family

ID=16724888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60218754A Granted JPS6275697A (ja) 1985-09-30 1985-09-30 発光ダイオ−ドチツプを用いた発光表示体

Country Status (1)

Country Link
JP (1) JPS6275697A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165097A (ja) * 2004-12-03 2006-06-22 Harison Toshiba Lighting Corp 発光素子の外囲器
JP4604252B2 (ja) * 2007-07-25 2011-01-05 Ｎｅｃアクセステクニカ株式会社 複数色表示システム
JP2022107942A (ja) * 2021-01-12 2022-07-25 シーシーエス株式会社 Ｌｅｄ光源

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5324294A (en) * 1976-08-19 1978-03-06 Matsushita Electric Ind Co Ltd Light source for information reader

Also Published As

Publication number Publication date
JPS6275697A (ja) 1987-04-07

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